| PART |
Description |
Maker |
| 43045-0202 43045-0200 43045-0201 430450200 43045-0 |
MICRO-FIT (3.0) DUAL ROW RIGHT ANGLE THRU HOLE HEADER ASSY
|
Molex Electronics Ltd.
|
| 4-103240-0-03 4-103240-0-16 |
HEADER ASSY, MOD II, BREAKAWAY, DOUBLE ROW, .100X.100CL, VERTICAL, WITH .025 SQ POSTS
HEADER ASSY, MOD II, BREAKAWAY, DOUBLE ROW, .100X.100CL, VERTICAL,WITH .025 SQ POSTS
|
Tyco Electronics
|
| 85013-3093 0850133093 |
2.54mm (.100) Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0μm (39μ)Selective Gold (Au), 96 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0渭m (39渭")Selective Gold (Au), 96 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Through Hole, Vertical, Style R, 1.0楼矛m (39楼矛")Selective Gold (Au), 96 Circuits
|
Molex Electronics Ltd.
|
| 87914-2815 0879142815 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87891-2817 0878912817 |
2.54mm (.100 Header, Through Hole, Breakaway, Vertical, 28 Circuits 2.50渭m (100渭 Tape on Reel Packaging, Lead-free
2.54mm (.100 Header, Through Hole, Breakaway, Vertical, 28 Circuits 2.50μm (100μ Tape on Reel Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 15-80-0141 A-70567-0005 0015800141 705670005 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 36511-0122 0365110122 MMB1502R963 MM-B1502-R963 |
2.54mm (.100) Pitch DIN 41612 Header, Style R, Through Hole, Vertical, 0.60μm (24μ) Gold (Au) Plating, Tail Length 4.50mm (.177), 64 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Style R, Through Hole, Vertical, 0.60渭m (24渭") Gold (Au) Plating, Tail Length 4.50mm (.177"), 64 Circuits
2.54mm (.100") Pitch DIN 41612 Header, Style R, Through Hole, Vertical, 0.60楼矛m (24楼矛") Gold (Au) Plating, Tail Length 4.50mm (.177"), 64 Circuits
|
Molex Electronics Ltd.
|
| 15-80-0105 0015800105 A-70567-0139 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0125 0015800125 70567-0140 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76渭m (30渭") Gold (Au) Selective Pla
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
| 15-80-0065 0015800065 70567-0137 A-70567-0137 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plati
Molex Electronics Ltd.
|
Molex Electronics Ltd.
|
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